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NEXCOM Launches Next-Gen AI Edge Fanless Panel PC Series at Embedded World 2026
NEXCOM will launch APPC C21-01 series fanless panel PCs at Embedded World 2026 (EW 2026) show in Nuremberg, Germany. NEXCOM’s booth will have live...
Vertiv & Netweb Deliver Liquid Cooling for AI Data Centers
Vertiv, a global leader in critical digital infrastructure, announced a collaboration with Netweb Technologies India Ltd., a leading Indian high-end computing solutions provider, to...
OutSystems Launches Elevate Partner Program
OutSystems, a leading AI development platform, announced the launch of Elevate, its redesigned global partner program. Built to accelerate AI development, Elevate marks a strategic...
IESA 2026 Charts India’s Design-to-Manufacturing Path
The India Electronics & Semiconductor Association (IESA), the nation’s premier industry body for the Electronics System Design and Manufacturing (ESDM) sector, inaugurated the IESA...
HCLTech and IIT Kanpur to advance deep tech innovation for GCCs
HCLTech, a leading global technology company, and the Indian Institute of Technology (IIT) Kanpur have signed a Memorandum of Understanding (MoU) to jointly convert...
