Quectel Unveils Versatile Pi Series SBCs To Power Developer Innovation
Nuremberg, Germany – Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announces the launch of its range of Quectel Pi series...
ST Enters High-Volume Production Of Its Industry-Leading Silicon Photonics Platform To Support AI Infrastructure Demand
PIC100 technology in 300 mm high-volume production for leading hyperscalers, with plans to quadruple capacity by 2027 and further expand in...
ROHM Has Begun Online Sales Of New SiC Molded Modules
ROHM has begun online sales of new SiC molded modules: TRCDRIVE pack™, HSDIP20 and DOT-247. Amid growing concerns over tightening global power...
Würth Elektronik Introduced New Radio Module Variants
Waldenburg (Germany)– With the Proteus-IV and Ophelia-IV components, Würth Elektronik presents two new high-performance RF modules based...
Ambiq Wins Embedded World 2026 Award For HeliaAOT
AUSTIN — Ambiq Micro, Inc., a technology leader in ultra-low power semiconductor solutions for edge...
