Semiconductor

R&S & Broadcom Demo First Wi‑Fi 8 RF Tests for Next‑Gen Connectivity

Rohde & Schwarz, in collaboration with Broadcom, will display its CMX500 multi-technology multi-channel signaling tester at MWC Barcelona 2026 with newly added Wi-Fi 8 (IEEE 802.11bn) testing capabilities. The...

NXP India Announced the Launch of Season 6 of the NXP India Tech Startup Challenge

In partnership with Startup India Hub, Extreme Tech Challenge (XTC), Electropreneur Park, Semiconductor Fabless Acceleration Lab (SFAL), FabCi and INCeNSE, the program will provide...

Ericsson launches Agentic rApp as a Service on AWS to accelerate Autonomous Networks transformation

The new Agentic rApp as a Service solution enables fast, scalable, flexible deployment of rApps on AWS Marketplace The solution introduces Agentic AI and Generative...

India Must Power AI Data Hubs with Renewables Deloitte report 

Launched at the AI Summit, Deloitte Asia Pacific’s Powering Asia Pacific’s Data Centre Boom report highlights that as the region emerges as the next major global data...

R&S Highlights Embedded Test Solutions at Embedded World 2026

Rohde & Schwarz will present its advanced test and measurement solutions for the embedded industry at embedded world Exhibition & Conference in Nuremberg, Germany. Visitors can...

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