We had a successful showing at Embedded World 2026.
RiseLink’s newest chip, the BK7259, was nominated for Best in Show in the AI and Machine Learning category due to its Edge AI capabilities. Our Head of US, Dr. Diana Zhu, was interviewed for comments. Here are some behind the scenes pictures of the interview.
We also had a chance to highlight some of the other new chips being developed, specifically the BK7239N, which combines low power with WiFi 6 connectivity. In addition, we continued to highlight the BK7258 chip, which powers our dev boards and can be used for cameras and displays over WiFi and BLE.
CEO Dr. Pengfei Zhang presented on how to reduce latency for AI engines to enable responsive AI. This work is in partnership with Agora, which provides conversational AI engines for applications like AI toys.
We couldn’t forget the chance to see and learn more of our host city, Nuernberg. This was an excellent trip to learn more about embedded systems worldwide, and connect with a technical audience that can make use of low power connectivity solutions.
Thank you to everyone who stopped by our booth, from engineers to students. We learned a lot from you and are excited to come back! We’ve already booked our booth for next year.
