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Silicon Integration Initiative CMC Reveals 2026 Compact Modeling Meet
The Si2 Compact Model Coalition, IEEE, and IEEE EDS are sponsoring the second edition of the International Compact Modeling Conference (ICMC), a two-day in-person...
HFCL Joins IIT Delhi-Led Consortium for Hollow-Core Fiber Tech
HFCL Limited has joined the consortium of a Department of Telecommunications (DoT)-funded research project led by the Indian Institute of Technology, Delhi (IIT Delhi)...
BorgWarner to Supply Integrated Drive Module for European Hybrid OEM
BorgWarner has secured a program award from a premium European original equipment manufacturer (OEM) to supply an 800V Integrated Drive Module (iDM) supporting a...
EMIS to Showcase EMI Filter Range at EMV Expo 2026
Global EMC solutions provider EMIS announces their attendance at EMV Expo & Conference 2026 in Cologne from 24th– 26th March. EMIS will be sharing their...
R&S & Broadcom Demo First Wi‑Fi 8 RF Tests for Next‑Gen Connectivity
Rohde & Schwarz, in collaboration with Broadcom, will display its CMX500 multi-technology multi-channel signaling tester at MWC Barcelona 2026 with newly added Wi-Fi 8 (IEEE 802.11bn) testing capabilities. The...
