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Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs
Solution addresses design bottleneck by automating complex workflows
Keysight Technologies, Inc. (NYSE: KEYS) today introduced 3D Interconnect Designer, a new addition to its Electronic Design...
Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
Scalability and functional safety enabled by chiplet technology Auto-grade quality for large, modern AI NPUsAdvanced power control for higher performance, improved power efficiency and...
Renesas Develops 3nm TCAM Technology Combining High Memory Density and Low Power, Suitable for Automotive SoCs
Achieves flexible, small-block configuration for large-scale TCAMs Cuts search energy and boosts speed through efficient search processing Enhanced functional safety enables application beyond networking...
Vishay Intertechnology AEC-Q200 Qualified Thick Film Chip Resistors
Devices Save Space While Maintaining High Reliability in Automotive, Industrial, and Telecommunications Applications
Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of AEC-Q200...
VIAVI Highlights Importance of Trusted Partner Collaboration in AI Era and Outlines Core Solution Areas for Communications and Networking at MWC Barcelona
Over 30 demonstrations across AI data center, security and quantum safe, mission-critical communications, AIOps, 6G and AI-RAN to be showcased at stand 5B18
VIAVI Solutions...
