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Dai Nippon Printing Invests in Rapidus to Advance Next-Gen Chip Mass Production

Dai Nippon Printing Co., Ltd. announced that it has participated in Rapidus Corporation’s funding round as one of the round investors. This strategic funding...

Capgemini and Deutsche Telekom engineer an Open Platform for Intelligent RAN Automation

Capgemini, announced a new agreement with Deutsche Telekom to engineer a unified, open platform for intelligent Radio Access Network (RAN) automation. The solution is designed to...

HighPoint Tech Debuts PCIe 5.0 External Fabric Powered by PCI-SIG CopprLink

HighPoint Technologies, the leading provider of high-performance PCI Express (PCIe) switching and storage expansion solutions, is proud to announce the launch of HighPoint’s External CopprLink...

SEMI FlexTech Reveals 2026 FLEXI Award Winners for Excellence in Flexible Electronics

Recognizing innovations and other outstanding accomplishments in flexible hybrid electronics (FHE), FlexTech, a SEMI Technology Community, announced winners of the 2026 FLEXI Awards presented at...

Aaronia Showcases AARTOS at Enforce Tac 2026

As the global security environment becomes increasingly shaped by contested electromagnetic spectrum operations, defense and security organizations face growing challenges from non-cooperative UAVs, complex...

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