The Si2 Compact Model Coalition, IEEE, and IEEE EDS are sponsoring the second edition of the International Compact Modeling Conference (ICMC), a two-day in-person...
HFCL Limited has joined the consortium of a Department of Telecommunications (DoT)-funded research project led by the Indian Institute of Technology, Delhi (IIT Delhi)...
BorgWarner has secured a program award from a premium European original equipment manufacturer (OEM) to supply an 800V Integrated Drive Module (iDM) supporting a...
Global EMC solutions provider EMIS announces their attendance at EMV Expo & Conference 2026 in Cologne from 24th– 26th March. EMIS will be sharing their...
Rohde & Schwarz, in collaboration with Broadcom, will display its CMX500 multi-technology multi-channel signaling tester at MWC Barcelona 2026 with newly added Wi-Fi 8 (IEEE 802.11bn) testing capabilities. The...