Tag: Top 10 News
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FineX. Makes Shielding Clear. –
Panasonic Industry launches high‑transparency, low‑resistance, flexible transparent conductive film for electromagnetic wave shield with pre‑applied OCA
Panasonic Industry announces the release of FineX (“FineCross”), a next‑generation...
SIMCom Launches New Compact, Smart AI Modules –
AI core, MCU and Wi-Fi/Bluetooth connectivity in one 43 x 44 x 3.2mm module See SIMCom at Embedded Worldon Booth3-525,Messe Nürnberg,Nuremburg, Germany, March...
Empower Semiconductor Showcases Vertical Power Delivery Innovations at APEC 2026
Two APEC industry sessions and next-generation current density advances underscore Empower’s leadership in powering kilowatt-class AI processors
Empower Semiconductor, the world leader in powering artificial...
Introducing Octopart Discover: From Part Search to Solutions Discovery
Octopart, an Altium company, today introduced Octopart Discover, the next evolution of Octopart that brings design intent and persistent system context into solutions discovery...
Everspin Launches New Generation of Unified Memory for Embedded Systems
UNISYST MRAM unifies code storage and data memory in a high-density, non-volatile architecture for edge AI, industrial and mission-critical designs
Everspin Technologies, Inc. (NASDAQ: MRAM),...
