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VIAVI to Showcase Breakthrough AI Fabric and Optical Test Advances at OFC 2026

Demonstrations include 1.6T high-speed Ethernet, silicon photonics, PCIe and fiber sensing solutions VIAVI Solutions Inc. (VIAVI) (NASDAQ: VIAV) will showcase advanced technologies for the validation...

Advanced MES Capabilities for Scalable, High-Quality Solar Cell and Module Manufacturing

FabEagleMES Introduces New Tools for Quality, Traceability, and Data-Driven Production Control Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), offers industrial software for...

Teledyne FLIR OEM Launches Lepton XDS at Mobile World Congress; A Compact Thermal‑Visible Camera Module Featuring Patented MSX Technology

Prism ISP–Powered Dual Camera Module Delivers Enhanced Performance and Faster Integration for OEMs Teledyne FLIR OEM, a part of Teledyne Technologies Incorporated (NYSE: TDY), today...

HARMAN Embedded Audio Showcases Connected Device Innovation at Mobile World Congress 2026

HARMAN Embedded Audio (HEA), a leading end‑to‑end B2B embedded audio solutions provider, announced it will showcase how global brands can differentiate connected devices through...

GCF report highlights growth in manufacturers undergoing device certification, with a record number of 106

GCF’s Device Technology Trends Report also shows strong growth in wireless module and automotive device certifications in 2025 The Global Certification Forum (GCF) has published its annual...

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