Dai Nippon Printing Invests in Rapidus to Advance Next-Gen Chip Mass Production
Dai Nippon Printing Co., Ltd. announced that it has participated in Rapidus Corporation’s funding round as one of the round investors. This strategic funding...
Capgemini and Deutsche Telekom engineer an Open Platform for Intelligent RAN Automation
Capgemini, announced a new agreement with Deutsche Telekom to engineer a unified, open platform for intelligent Radio Access Network (RAN) automation. The solution is designed to...
SEMI FlexTech Reveals 2026 FLEXI Award Winners for Excellence in Flexible Electronics
Recognizing innovations and other outstanding accomplishments in flexible hybrid electronics (FHE), FlexTech, a SEMI Technology Community, announced winners of the 2026 FLEXI Awards presented at...
Lane Motorsport sign distribution agreement with Axon’ Cable Ltd
Lane Motorsport, the specialist division of Lane Electronics, has signed a UK- and Ireland-wide distribution agreement with Axon’ Cable Limited, a subsidiary of the Axon’ group who have been manufacturing...
Rimac Tech Appoints Nurdin Pitarević as CEO to Lead Next Phase of Global Growth
Rimac Technology, announced a leadership transition as the company enters its next phase of growth as a global Tier 1 supplier to the automotive...
