NEXCOM Launches Next-Gen AI Edge Fanless Panel PC Series at Embedded World 2026
NEXCOM will launch APPC C21-01 series fanless panel PCs at Embedded World 2026 (EW 2026) show in Nuremberg, Germany. NEXCOM’s booth will have live...
Vertiv & Netweb Deliver Liquid Cooling for AI Data Centers
Vertiv, a global leader in critical digital infrastructure, announced a collaboration with Netweb Technologies India Ltd., a leading Indian high-end computing solutions provider, to...
OutSystems Launches Elevate Partner Program
OutSystems, a leading AI development platform, announced the launch of Elevate, its redesigned global partner program. Built to accelerate AI development, Elevate marks a strategic...
HCLTech and IIT Kanpur to advance deep tech innovation for GCCs
HCLTech, a leading global technology company, and the Indian Institute of Technology (IIT) Kanpur have signed a Memorandum of Understanding (MoU) to jointly convert...
Vishay Boosts Industrial Efficiency with New Optocouplers
Vishay Intertechnology, introduced a new series of phototransistor optocouplers that combine a high and linear current transfer ratio (CTR) over temperature with a low...
